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Access Time
The average time (in nanoseconds) for RAM to complete one access. Access Time
is composed of address setup time and latency (the time it takes to initiate a
Request for data and prepare access).
Backside Bus
(BSB) - The data path that runs between the CPU and L2 cache.
Bandwidth
The amount of data moved on electronic lines, such as a bus, per second.
bandwidth is usually measured in bits per second, bytes per second, or cycles
per Second (Hertz).
Bank Schema
A method of diagramming memory configurations. The bank schema consists of rows
and/or columns that represent memory sockets on a computer board. Rows indicate
independent sockets; columns represent banks.
Base Rambus
The first generation of Rambus technology, first shipped in 1995.
Binary
A numbering system that uses combinations of 0 and 1 to represent data. Also
known as Base 2.
Bit
The smallest unit of information a computer processes. A bit is 1 or 0.
Buffer
A holding area for data shared by devices that operate at different speeds or
have different priorities. A buffer allows a device to operate without the
delays that other devices impose.
Buffered Memory
A memory module that contains buffers. Buffers re-drive the signals through the
memory chips and allow the module to include more memory chips. Buffered and
unbuffered memory cannot be mixed. The design of the computer memory controller
dictates whether memory must be buffered or unbuffered.
Bus
A data path in a computer, consisting of various parallel wires to which the
CPU, memory, and all input/output devices are connected.
Bus Cycle
A single transaction between main memory and the CPU.
Byte
Eight bits of information. The byte is the fundamental unit of computer
processing; almost all specifications and measures of computer performance are
in bytes or multiples thereof. See kilobytes and megabytes.
Cache Memory
A small amount (normally less than 1MB) of high-speed memory residing on or
close to the CPU. Cache memory supplies the processor with the most frequently
requested data and instructions. Level 1 cache (primary cache) is the cache
closest to the processor. Level 2 cache (secondary cache) is the cache second
closest to the processor and is usually on the motherboard.
CAS
(Column Address Strobe) - A memory chip signal that latches the column address
of a particular location in a row-column matrix.
CAS Latency
The ratio between column access time and clock cycle time. CAS Latency 2 (CL2)
offers a slight performance increase over CAS Latency 3 (CL3).
Chipset
Microchips that support the CPU. The chipset usually contains several
controllers that govern how information travels between the processor and other
components.
CPU
(Central Processing Unit) - The computer chip that has primary responsibility
for interpreting commands and running programs. The CPU is also known as the
processor or microprocessor.
DDR SDRAM
(Double Data Rate Synchronous Dynamic Random-Access Memory) - The latest
generation of SDRAM technology. Data is read on both the rising and the falling
edge of the computer clock, thereby delivering twice the bandwidth of standard
SDRAM. With DDR SDRAM, memory speed doubles without increasing the clock
frequency.
DIMM
(Dual In-line Memory Module) - A printed circuit board with gold contacts and
memory devices. A DIMM is similar to a SIMM, but with this primary difference:
unlike the metal leads on either side of a SIMM, which are "tied together"
electrically, the leads on either side of a DIMM are electrically independent.
Direct Rambus
Rambus technology's third generation, which offers a completely new DRAM
architecture for high-performance PCs. Data transfers at speeds up to 800MHz
over a narrow 16-bit channel, compared to current SDRAM, which operates at
100MHz on a wide 64-bit bus.
DRAM
(Dynamic Random-Access Memory) - The most common form of RAM. DRAM can hold
data for only a short time. To retain data, DRAM must be refreshed
periodically. If the cell is not refreshed, the data will disappear.
Dual-Banked
A memory module having two banks.
Dual Channel
Based on the dual channel system board designs, memory modules are installed on
two separate channels, each with it's own access route to the memory
controller. The dual memory channel design doubles the peak bandwidth of single
memory channels. Best results occur when a matched-pair memory kit is used
ensuring that the modules are identical.
ECC
(Error Correction Code) - A method of checking the integrity of data in DRAM.
ECC provides more elaborate error detection than parity; ECC can detect
multiple-bit errors and can locate and correct single-bit errors.
Even Parity
A type of data integrity checking whereby the parity bit checks for an even
number of 1s.
Form Factor
The size, configuration, and other specifications used to describe hardware.
Examples of memory form factors are: SIMM, DIMM, RIMM, 30-pin, 72-pin, and
168-pin.
Frontside Bus
(FSB) - The data path that runs between the CPU and main memory (RAM).
Gigabit
Approximately 1 billion bits, or exactly 1 bit x 1,0243 (1,073,741,824) bits.
Gigabyte
Approximately 1 billion bytes, or exactly 1 byte x 1,0243 (1,073,741,824)
bytes.
Heat Spreader
A sheath, usually aluminum, that covers an electronic device and dissipates
heat.
Heat Sink
A component, typically zinc alloy, that dissipates heat. CPUs require heat
sinks.
IC
(Integrated Circuit) - An electronic circuit on a semiconductor chip. The
circuit includes components and connectors. A semiconductor chip is usually
molded in a plastic or ceramic case and has external connector pins.
Kilobit
Approximately one thousand bits, or exactly 1 bit x 210 (1,024) bits.
Kilobyte
Approximately one thousand bytes, or exactly 1 byte x 210 (1,024) bytes.
Level 1 Cache
(L1) - Also known as primary cache, L1 Cache is a small amount of high-speed
memory that resides on or very close to the processor. L1 Cache supplies the
processor with the most frequently requested data and instructions.
Level 2 Cache
(L2) - Also known as secondary cache, L2 Cache is a small amount of high-speed
memory close to the CPU and usually on the motherboard. L2 Cache supplies the
processor with the most frequently requested data and instructions. Depending
on the motherboard, Level 2 cache may be upgraded.
Logic Board
See Motherboard.
Megabit
Approximately one million bits, or exactly 1 bit x 1,0242 (1,048,576) bits.
Megabyte
The most common term used to denote the capacity of a memory module. One
megabyte equals approximately one million bytes, or exactly 1 byte x 1,0242
(1,048,576) bytes.
Memory
A computer's random-access memory. Memory temporarily holds data and
instructions for the CPU. See RAM.
Memory Bank
A logical unit of memory in a computer, the size of which the CPU determines.
For example, a 32-bit CPU requires memory banks that provide 32 bits of
information at a time. A bank can consist of one or more memory modules.
Memory Bus
The bus that runs from the CPU to the memory expansion slots.
Memory Controller Hub
(MCH) - The interface between the processor, Accelerated Graphics Port, and
RDRAM on motherboards that use Intel's 820 or 840 chipsets.
Memory Translator Hub
(MTH) - The interface that allows SDRAM memory to be supported on a Direct
Rambus Channel for motherboards using Intel's 820 chipset.
Motherboard
Also known as the logic board, main board, or computer board, the motherboard
is the computer's main board and in most cases holds all CPU, memory, and I/O
functions or has expansion slots for them.
Nanosecond
(ns) - One billionth of a second. Memory data access times are in nanoseconds.
For example, memory access times for typical 30- and 72-pin SIMM modules range
from 60 to 100 nanoseconds.
Odd Parity
Data integrity checking in which the parity bit checks for an odd number of 1s.
Parity
Data integrity checking that adds a single bit to each byte of data. The parity
bit is used to detect errors in the other 8 bits.
Proprietary Memory
Memory custom designed for a specific computer.
RAM
(Random-Access Memory) - A memory cell configuration that holds data for
processing by a central processing unit (CPU). Random means the CPU can
retrieve data from any address within RAM. See also Memory.
Rambus
(1) Rambus, Inc. develops and licenses high-performance memory logic and
circuit design technology and provides licensees with product design, layout,
and testing information. (2) Direct Rambus is a high-speed memory technology
that uses a narrow 16-bit bus (Rambus channel) to transmit data at speeds up to
800MHz. See Rambus Channel.
Rambus Channel
The data path of Rambus systems. Because of the narrow data width (two bytes),
Rambus modules transfer data at up to 800MHz.
RAS
A memory chip signal that latches the row address of a particular location in a
row-column matrix.
Refresh
Refreshing maintains data stored in DRAM. The process of refreshing electrical
cells on a DRAM component is similar to recharging batteries. Different DRAM
components require different refresh methods.
Refresh Rate
The number of DRAM component rows that must be refreshed. Three common refresh
rates are 2K, 4K and 8K.
Registered Memory
SDRAM memory that contains registers directly on the module. The registers
re-drive the signals through the memory chips and allow the module to be built
with more memory chips. Registered and unbuffered memory cannot be mixed. The
design of the computer memory controller dictates which type of memory the
computer requires.
RIMMT
The trademarked name for a Direct Rambus memory module. A RIMMT conforms to the
DIMM form factor and transfers data 16 bits at a time.
RIMM Connector
A Direct Rambus memory socket.
SDRAM
(Synchronous DRAM) - A DRAM technology that uses a clock to synchronize signal
input and output on a memory chip. The clock is coordinated with the CPU clock
so the timing of the memory chips and the timing of the CPU are in synch.
Synchronous DRAM saves time in executing commands and transmitting data,
thereby increasing the overall performance of the computer. SDRAM allows the
CPU to access memory approximately 25 percent faster than EDO memory.
Self-Refresh
A memory technology that enables DRAM to refresh on its own and independent of
the CPU or external refresh circuitry. Self-Refresh technology is built into
the DRAM chip itself and reduces power consumption dramatically. Notebook and
laptop computers use this technology.
SIMM
(Single In-line Memory Module) - A printed circuit board having memory devices
and gold or tin/lead contacts. A SIMM plugs into a computer memory expansion
socket. SIMMs offer two main advantages: ease of installation and minimal
consumption of board surface. A vertically mounted SIMM requires only a
fraction of the space required by a horizontally mounted DRAM. A SIMM may have
as few as 30 or as many as 200 pins. On a SIMM, the metal leads on either side
of the board are electrically tied together.
SIMM Socket
A motherboard component that holds a single SIMM.
Single-Banked
A module that has only one bank or row.
SO DIMM
(Small-Outline Dual In-line Memory Module) - An enhanced version of a standard
DIMM. A 72-pin small-outline DIMM is about half the length of a 72-pin SIMM.
144-pin and 200-pin modules are the most common SO DIMMs today.
SO-RIMMT
The trademarked name for a Direct Rambus memory module in notebook computers.
SO-RIMMTs provide memory bandwidth comparable to desktop memory configurations.
Storage
A data-holding device, such as a hard disk or CD-ROM.
Unbuffered Memory
Memory that does not contain buffers or registers located on the module.
Instead, these devices are located on the motherboard
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